The purpose of this book is to discuss datacom (data center and telecommunication) power trends at the equipment level as well as to describe how to use those trends in making critical decisions on infrastructure (e.g., cooling system) requirements and the overall facility. There is an information gap that needs to be bridged between the information technology (IT) industry and the facility design/construction/operation industry. Today’s datacom facilities require a holistic approach, balancing the tradeoffs between datacom equipment and facility cooling infrastructure. Based on the latest information from all the leading datacom equipment manufacturers, Datacom Power Trends and Cooling Applications provides new and expanded datacom equipment power trend charts to allow the datacom facility designer to more accurately predict the datacom equipment loads that the facility can expect to have to accommodate in the future as well as providing ways of applying the trend information to datacom facility designs today. Also included in this book is an overview of various air and liquid cooling system options that may be considered to handle the future loads and an invaluable appendix containing a collection of terms and definitions used by the datacom equipment manufacturers, the facilities operation industry, and the cooling design and construction industry.

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PDF Pages	PDF Title
12	Purpose / Objective
13	Overview of Chapters
14	Datacom Facility Planning
15	DATACOM FACILITY AREA BREAKDOWN EXAMPLE (Note: Numbers Can Vary Dramatically)
16	Figure 2-1 Datacom facility area allocation example.
17	Simple Example of Datacom Equipment Growth Impact on a Facility
21	Figure 2-2 Summary comparison of current and new environmental metrics of 5,000 ft2 example facility scenarios.
22	Overview of Power Density Definitions
23	IT and Facility Industry Collaboration
24	IT Industry Background
26	Introduction
28	Definition of Watts per Equipment Square Foot Metric The Thermal Management Consortium and the Uptime Institute Trend Chart
29	Figure 3-1 Graphical representation of width ¥ depth measurements used for equipment ft2 definitions. Figure 3-2 Uptime Institute power trend chart.
30	Trend Chart Evolution Tape Storage / Stand-alone Workstations
31	Figure 3-3 Previous power trend chart. Figure 3-4 New power trend chart: workstations and tape storage projections.
32	Servers and Disk Storage Systems Figure 3-5 New power trend chart: compute and storage servers split. Communication Equipment
33	Figure 3-6 New power trend chart: compute servers’ second split. Figure 3-7 New power trend chart: compute and storage server projection.
34	Figure 3-8 New power trend chart: communication high-density equipment trend introduced. ASHRAE Updated and Expanded Power Trend Chart
35	Figure 3-9 New power trend chart: communication extreme and high-density equipment projection. Figure 3-10 New ASHRAE updated and expanded power trend chart.
36	Product Cycle vs. Building Life Cycle Predicting Future Loads
37	Provisioning For Future Loads
40	Introduction
41	Figure 4-1 Hot-aisle/cold-aisle cooling principle. Air Cooling Overview
42	Underfloor Distribution Figure 4-2 Raised floor implementation most commonly found in data centers today using CRAC units.
43	Figure 4-3 Raised floor implementation using building air from a central plant. Figure 4-4 Raised floor implementation using two-story configuration with CRAC units on the lower floor.
44	Overhead Distribution Figure 4-5 Overhead cooling distribution commonly found in central office environments. Managing Supply and Return Airflows
45	Figure 4-6 Raised floor implementation using a dropped ceiling as a hot air return plenum. Figure 4-7 Raised floor implementation using baffles to limit hot-aisle/cold-aisle “mixing.”
46	Figure 4-8 Raised floor implementation using inlet and outlet plenums/ducts integral to the rack. Figure 4-9 Raised floor implementation using outlet plenums/ducts integral to the rack.
47	Local Distribution
48	Figure 4-10 Local cooling distribution using overhead cooling units mounted to the ceiling. Figure 4-11 Local cooling distribution using overhead cooling units mounted to the rack.
49	Air Cooling Equipment Figure 4-12 Local cooling via integral rack cooling units on the exhaust side of the rack. Figure 4-13 Local cooling via integral rack cooling units on the inlet side of the rack.
50	Reliability
52	Introduction
53	Liquid Cooling Overview Liquid-Cooled Computer Equipment
54	Figure 5-1 Internal liquid cooling loop restricted within rack extent.
55	Figure 5-2 Internal liquid cooling loop with rack extents and liquid cooling loop external to racks. Figure 5-3 Internal liquid cooling loop extended to liquid-cooled external modular cooling unit.
56	FluorinertTM Water
57	Refrigerant Datacom Facility Chilled Water System
58	Figure 5-4 Typical example of chilled water loop and valve architecture.
59	Reliability
62	References Bibliography
86	ASHRAE Updated And Expanded Power Trend Chart-Additional Data
87	Figure B-1 New ASHRAE updated and expanded power trend chart (SI units).
89	Figure B-2 New ASHRAE updated and expanded power trend chart (non-log scale, I-P units).
90	Figure B-3 New ASHRAE updated and expanded power trend chart (non-log scale, SI units).
91	Figure B-4 New ASHRAE updated and expanded power trend chart (non-log scale, kW per rack).
92	Figure B-5 New ASHRAE updated and expanded power trend chart (non-log scale, watts per square foot).
94	International Technology Roadmap for Semiconductors (ITRS) Semiconductors
95	Figure C-1 Moore’s law.
96	Bipolar and CMOS Overview
97	Figure C-2 CMOS impact on heat flux.
98	Introduction Processor Memory Board
99	Servers Figure D-1 Processor of CPU. Figure D-3 Typical memory chip.
100	Figure D-4 Typical circuit board or motherboard.
101	Figure D-5 Various server packaging.
102	Figure D-6 Typical compute server rack and packaging.
103	Figure D-7 Typical custom compute server rack.
104	Figure D-8 Typical custom storage server rack.
105	Figure D-9 Typical blade servers.
106	Figure D-10 Typical blade server chassis. Figure D-11 ASHRAE TC 9.9 definitions for airflow. Rack
107	Figure D-12 Typical data processing rack configuration.
108	Figure D-13 Typical telecommunications rack configuration. Figure D-14 Standard telecommunications rack.
109	Rows Figure D-15 Typical datacom facility row alignment. Technical Space (Raised Floor)
110	Datacom Facility
111	Figure D-16 Overview of a typical datacom facility.

Published By	Publication Date	Number of Pages
ASHRAE	2005	123


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Standard Title	Datacom Equipment Power – Trends and Cooling Applications
Published Code	ASHRAE
Publication Date	2005
Pages Count	123

ASHRAE DatacomEquipmentPowerTrendsandCoolingApplications 2005

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