BS CECC 23800-801:1998
$142.49
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
| Published By | Publication Date | Number of Pages |
| BSI | 1998 | 24 |
| Status | Definitive |
|---|---|
| Pages | 24 |
| Publication Date | 1998-06-15 |
| ISBN | 0 580 29889 2 |
| Standard Number | BS CECC 23800-801:1998 |
| Title | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections |
| Identical National Standard Of | CECC 23800-801:1998 |
| Descriptors | Designations, Electrical equipment, Contaminants, Specimen preparation, Conformity, Metal coatings, Edge socket connectors, Assessed quality, Inspection, Organic coatings, Holes, Electronic equipment and components, Detail specification, Thickness, Approval testing, Bonding, Dimensional measurement, Finishes, Surface treatment, Printed-circuit boards, Electrical testing, Ageing tests, Capability approval, Visual inspection (testing), Solderability testing, Quality assurance systems, Electrical insulation, Mechanical testing, Electrical components, Resistance measurement, Specification (approval), Defects, Porosity measurement, Printed circuits, Preferred sizes |
| Publisher | BSI |
| Committee | EPL/501 |
| ICS Codes | 31.180 - Printed circuits and boards |
