BS EN 60749-25:2003
$102.76
Semiconductor devices. Mechanical and climatic test methods – Temperature cycling
| Published By | Publication Date | Number of Pages |
| BSI | 2003 | 16 |
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
