BS EN IEC 61760-1:2020
$189.07
Surface mounting technology – Standard method for the specification of surface mounting components (SMDs)
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 50 |
IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 5 | Annex ZA(normative)Normative references to international publications with their corresponding European publications |
| 7 | English CONTENTS |
| 10 | FOREWORD |
| 12 | INTRODUCTION |
| 13 | 1 Scope 2 Normative references |
| 14 | 3 Terms and definitions |
| 16 | 4 Requirements for component design and component specifications 4.1 General requirement 4.2 Component marking 4.2.1 Marking of multipin components 4.2.2 Marking of components with polarity |
| 17 | 4.2.3 Durability of component marking 4.3 Component outline and design 4.3.1 Drawing and specification Figures Figure 1 – Example of a component with marked specific orientation put in tape (top) and tray (bottom) |
| 18 | 4.3.2 Termination design 4.3.3 Pick-up area requirements |
| 19 | 4.3.4 Bottom surface requirements Figure 2 – Vacuum pipette, pick-up area and component compartment |
| 20 | 4.3.5 Requirements for terminals Figure 3 – Coplanarity of terminals Figure 4 – Stable seating of component |
| 21 | Figure 5 – Unstable seating of component Figure 6 – Terminals arranged peripherally in two rows Figure 7 – Good contrast between component body and surroundings |
| 22 | 4.3.6 Component height 4.3.7 Component weight 4.4 General requirements for components related to assembly technology 4.4.1 Robustness of components Figure 8 – Component weight and pipette suction strength |
| 23 | 4.4.2 Recommendation for land pattern design 4.5 Cleanliness of components 4.5.1 General remarks |
| 24 | 4.5.2 Particle contaminations 4.5.3 Ionic contamination 4.5.4 Other surface contamination 4.6 Surface roughness |
| 25 | 4.7 Requirements related to packaging and transportation 4.7.1 Packaging 4.7.2 Labelling of product packaging Tables Table 1 – Typical roughness requirements |
| 26 | 4.7.3 Storage and transportation 4.8 Component reliability assurance 4.9 Compliance information 4.9.1 General 4.9.2 Material declaration 4.9.3 Environmental regulatory compliance 4.9.4 Considerations on the materials’ supply chain |
| 27 | 5 Assembly processes 5.1 General 5.2 Placement or insertion 5.3 Mounting 5.4 Cleaning (where applicable) 5.4.1 Cleaning methods 5.4.2 Typical cleaning conditions for assemblies |
| 28 | 5.5 Post assembly processes 5.6 Removal and/or replacement of SMDs 5.6.1 Removal and/or replacement of soldered SMDs Table 2 – Basic cleaning processes |
| 29 | 5.6.2 Removal and/or replacement of glued SMDs 6 Soldering 6.1 General 6.1.1 Mounting by soldering |
| 30 | 6.1.2 Securing the component on the substrate prior to soldering 6.1.3 Reflow soldering Figure 9 – Process steps for soldering |
| 31 | 6.1.4 Wave soldering |
| 32 | 6.1.5 Other soldering methods 6.2 Process conditions 6.2.1 General 6.2.2 Reflow soldering |
| 33 | Figure 10 – Generic reflow temperature/time profile |
| 34 | 6.2.3 Wave soldering 6.3 Requirements for components and component specifications 6.3.1 General Figure 11 – Generic wave soldering temperature/time profile |
| 35 | 6.3.2 Requirements for temperature sensitive devices 6.3.3 Wettability 6.3.4 Resistance to dissolution of metallization 6.3.5 Resistance to soldering heat |
| 36 | 6.3.6 Resistance to vacuum during soldering 6.3.7 Resistance to cleaning solvent |
| 37 | 6.3.8 Warpage during reflow soldering 7 Conductive glue bonding 7.1 Mounting |
| 38 | 7.2 Bonding strength test for the component glue interface test Figure 12 – Process steps for gluing |
| 39 | 7.3 Requirements to components for conductive glue bonding 7.3.1 Components for conductive glue bonding 7.3.2 Cleanliness of the surface 7.3.3 Terminal surface defects 7.3.4 Outgassing of halogenic substances |
| 40 | 7.3.5 Coplanarity 7.3.6 Stand-off 7.3.7 Terminal dimensions and tolerances 7.3.8 Resistance to curing heat Figure 13 – Stand-off definition Table 3 – Examples of substances proposed to be includedin risk evaluation and customer reporting |
| 41 | 8 Sintering 8.1 General Table 4 – Examples of typical curing conditions |
| 42 | 8.2 Typical process conditions 8.3 Requirements for components and component specifications Figure 14 – Sinter process on one side, both sides,and both sides including presintering |
| 43 | 9 Solderless interconnection 9.1 General 9.2 Typical process conditions |
| 44 | 9.3 Requirements for components and component specifications |
| 45 | Annex A (informative)Details on compliance information A.1 Material declaration |
| 46 | A.2 Environmental regulatory compliance A.3 Considerations on the materials’ supply chain |
| 48 | Bibliography |
