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BS IEC 62047-36:2019

BS IEC 62047-36:2019

$102.76

Semiconductor devices. Micro-electromechanical devices – Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

Published By Publication Date Number of Pages
BSI 2019 20
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This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e., piezoelectric thin films used as actuators.

This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
5 FOREWORD
7 INTRODUCTION
8 1 Scope
2 Normative references
3 Terms and definitions
4 Testing procedure
4.1 General
9 4.2 Initial measurements
4.3 Tests
4.3.1 DUT setup and environmental conditions
4.3.2 Test duration
4.3.3 Number of tests and number of DUTs
Figures
Figure 1 – Flow of the testing procedure
10 4.4 Post treatment
4.5 Final measurements
5 Environmental and dielectric withstand testing
5.1 Environmental testing
5.1.1 General
11 5.1.2 High temperature bias test
5.1.3 High temperature and high humidity bias test
5.1.4 High temperature storage
Tables
Table 1 – Selectable test conditions
12 5.1.5 Low temperature storage
5.1.6 High temperature and high humidity storage
5.1.7 Soldering heat test
Table 2 – Selectable test conditions
Table 3 – Soldering heat test condition
13 5.1.8 Temperature cycling test
Figure 2 – Temperature profile for reflow soldering with lead-free solder
Table 4 – Conditions of temperature profile for reflow soldering with lead-free solder
14 5.2 Dielectric withstand testing
Figure 3 – Temperature profile of the temperature cycling test
15 Figure 4 – Example of a dielectric withstand test circuit for DC voltage
16 Annex A (informative)Report of test results
A.1 General
A.2 Environmental test
A.3 Dielectric withstand test
Table A.1 – High-temperature test
17 Figure A.1 – I-V measurement
Figure A.2 – Optical image of top electrodes before and after breakdown
Table A.2 – Dielectric withstand test
18 Bibliography

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BS IEC 62047-36:2019
$102.76