BS IEC 62951-4:2019
$102.76
Semiconductor devices. Flexible and stretchable semiconductor devices – Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 16 |
IEC 62951-4:2019 specifies an evaluation method of the bending fatigue properties of conductive thin film and flexible substrate for the application at flexible semiconductor devices. The films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film used for flexible semiconductor devices. The electrical and mechanical behaviours of films on the substrate are evaluated. The fatigue test methods include dynamic bending fatigue test and static bending fatigue test.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | English CONTENTS |
| 5 | FOREWORD |
| 7 | 1 Scope 2 Normative references 3 Terms and definitions |
| 8 | 4 Test piece 4.1 Design of test piece |
| 9 | 4.2 Preparation of a test piece 4.3 Measurement of dimensions 4.4 Storage prior to testing 5 Testing method and test apparatus 5.1 General 5.2 Test apparatus 5.3 Method of gripping |
| 10 | 5.4 Bending test 5.5 Dynamic bending fatigue test 5.6 Static bending fatigue test 5.7 Bending fatigue test of flexible substrate 5.8 Speed of bending fatigue test 6 Test 6.1 Test procedure |
| 11 | 6.2 Failure criterion (test termination) 6.3 Test environments 6.4 Recorded data 7 Test report |
| 12 | Annex A (informative) Various bending fatigue testers Figures Figure A.1 – Bending fatigue tester using curved mandrel and roller |
| 13 | Figure A.2 – Cyclic mandrel bending tester Figure A.3 – Collapsing radius bending fatigue tester Figure A.4 – X-Y-θ bending fatigue test method |
| 14 | Figure A.5 – Schematic of the bending fatigue test |
| 15 | Bibliography |
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