BSI PD IEC TR 60286-7:2019
$102.76
Packaging of components for automatic handling – Introduction of a bulk blister pack for miniaturized components
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 16 |
This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | English CONTENTS |
| 5 | FOREWORD |
| 7 | INTRODUCTION |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions 4 Existing bulk feeding systems and challenges 4.1 Challenges of miniaturized components |
| 9 | 4.2 Limitations of existing bulk feeding systems 5 Bulk blister pack 5.1 General conception 5.1.1 Packaging style 5.1.2 Component pockets 5.1.3 Sealing 5.1.4 Identification and labelling |
| 10 | 5.2 Outline and dimensions 5.2.1 Outline Figures Figure 1 – Typical bulk blister pack (structure) Figure 2 – Typical bulk blister pack (mechanism) |
| 11 | 5.2.2 Dimensions Figure 3 – Typical bulk blister pack (overall dimensions) |
| 12 | 5.3 Properties 5.3.1 Material 5.3.2 Electrostatic properties 6 Bulk feeding system 6.1 Applicability for component types and sizes 6.2 Example of an innovative bulk feeding system Figure 4 – Typical bulk blister pack (blister strip dimensions) |
| 13 | Figure 5 – Pick up area with components |
| 14 | Bibliography |
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