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BSI PD ISO/PAS 19451-1:2016:2018 Edition

$215.11

Application of ISO 26262:2011-2012 to semiconductors – Application of concepts

Published By Publication Date Number of Pages
BSI 2018 138
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This document is applicable to developers who are evaluating the use of semiconductor components or parts in hardware components, systems, or items developed according to ISO 26262.

PDF Catalog

PDF Pages PDF Title
2 undefined
8 Foreword
9 Introduction
10 1 Scope
2 Normative references
3 Terms and definitions
11 4 Symbols and abbreviated terms
13 5 Analogue/mixed signal components and ISO 26262
5.1 About analogue and mixed signal components
14 5.2 Analogue and mixed signal components and failure modes
5.2.1 About failure modes
22 5.2.2 About safe faults
23 5.2.3 About transient faults
5.3 Notes about safety analysis
5.3.1 General
5.3.2 Level of granularity of analysis
24 5.3.3 Examples of usage of failure mode distributions
25 5.3.4 Example of failure rates estimation for an analogue part
26 5.3.5 Example of safety metrics computation
40 5.3.6 Dependent failures analysis
5.3.7 Verification of architectural metrics computation
41 5.4 Examples of safety mechanisms
42 5.4.1 Resistive pull up/down
5.4.2 Over and under voltage monitoring
43 5.4.3 Voltage clamp (limiter)
5.4.4 Over-current monitoring
5.4.5 Current limiter
5.4.6 Power on reset
5.4.7 Analogue watchdog
44 5.4.8 Filter
5.4.9 Thermal monitor
5.4.10 Analogue Built-in Self-Test (Analogue BIST)
5.4.11 ADC monitoring
5.4.12 ADC attenuation detection
5.4.13 Stuck on ADC channel detection
45 5.5 About avoidance of systematic faults during the development phase
48 5.6 About safety documentation
6 Intellectual property and ISO 26262
6.1 About intellectual property
6.1.1 Understanding intellectual property
49 6.1.2 Types of intellectual property
50 6.2 Safety requirements for intellectual property
52 6.3 Intellectual property lifecycle
6.3.1 ISO 26262 and the intellectual property lifecycle
53 6.3.2 Intellectual property as safety element out of context (SEooC)
54 6.3.3 Intellectual property designed in context
6.3.4 Intellectual property use through hardware component qualification
6.3.5 Intellectual property use through proven in use argument
6.4 Work products for intellectual property
6.4.1 ISO 26262 and work products for intellectual property
6.4.2 Safety plan
55 6.4.3 Safety requirements and verification review of the IP design
6.4.4 Safety analysis report
6.4.5 Analysis of dependent failures
6.4.6 Confirmation measure reports
56 6.4.7 Development interface agreement
6.4.8 Integration documentation set
57 6.5 Integration of black-box intellectual property
58 7 Multi-core components and ISO 26262
7.1 Types of MC components
7.2 Implications of ISO 26262 on MC components
7.2.1 Introduction
59 7.2.2 ASIL decomposition in MC components
61 7.2.3 Coexistence of elements with different ASILs in MC components
62 7.2.4 Freedom from interference (FFI) in MC components
7.2.5 Software partitioning in MC components
63 7.2.6 Dependent failures in MC component
7.2.7 Timing requirements in MC component
64 8 Programmable logic devices and ISO 26262
8.1 About programmable logic devices
8.1.1 General
65 8.1.2 About PLD types
66 8.1.3 ISO 26262 Lifecycle mapping to PLD
69 8.2 Fault models and failure modes of PLD
70 8.3 Notes about safety analyses for PLDs
8.3.1 Quantitative analysis for a PLD
74 8.3.2 Dependent failure analysis for a PLD
76 8.4 Examples of safety mechanisms for PLD
77 8.5 Avoidance of systematic faults for PLD
8.5.1 Avoiding systematic faults in the implementation of PLD
8.5.2 About PLD supporting tools
8.5.3 Avoiding systematic faults for PLD users
79 8.6 Safety documentation for a PLD
80 8.7 Example of safety analysis for PLD
8.7.1 Architecture of the example
81 8.7.2 PLD external measures
82 8.7.3 PLD internal measures
86 9 Base failure rate estimation and ISO 26262 (all parts)
9.1 About base failure rate estimation
9.1.1 Impact of failure mechanisms on base failure rate estimation
9.1.2 Considerations in base failure rate estimation for functional safety
87 9.1.3 Techniques for base failure rate estimation
9.1.4 Documentation on the assumptions for base failure rate calculation
88 9.2 (General) clarifications on terms
9.2.1 Clarification of transient fault quantification
89 9.2.2 Clarification on component package failure rate
9.2.3 Clarification on power-up and power-down times
9.3 Permanent base failure rate calculation methods
9.3.1 Permanent base failure rate calculation using industry sources
97 9.3.2 Permanent base failure rate calculation using field data statistics
100 9.3.3 Calculation example of hardware component failure rate
103 9.3.4 Base failure rate calculation using accelerated life tests
104 9.3.5 Failure rate distribution methods
105 10 Semiconductor dependent failure analysis and ISO 26262
10.1 Introduction to DFA for semiconductors
106 10.2 Relationship between DFA and safety analysis
107 10.3 Dependent failure scenarios
109 10.4 Distinction between cascading failures and common cause failures
10.5 Dependent failure initiators
10.5.1 Dependent failure initiator list
115 10.5.2 Verification of mitigation measures
116 10.6 DFA workflow
118 10.6.1 DFA decision and identification of HW and SW elements (B1)
10.6.2 Identification of DFI (B2)
10.6.3 Sufficiency of insight provided by the available information on the effect of identified DFI (B3 and B4)
119 10.6.4 Consolidation of list of relevant DFI (B5)
10.6.5 Identification of necessary safety measures to control or mitigate DFI (B6)
10.6.6 Sufficiency of insight provided by the available information on the defined mitigation measures (B7 and B8)
10.6.7 Consolidate list of safety measures (B9)
10.6.8 ​Evaluation of the effectiveness to control or to avoid the dependent failure (B10)
120 10.6.9 ​Assessment of risk reduction sufficiency and if required improve defined measures (B11 and B12)
10.7 Examples of dependent failure analysis
10.7.1 Microcontroller example
126 10.7.2 Analog example
136 Bibliography
BSI PD ISO/PAS 19451-1:2016
$215.11