IPC 6015:1998
$27.95
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
Published By | Publication Date | Number of Pages |
IPC | 1998-02-01 | 32 |
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This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.
Published Code | IPC |
---|---|
Published By | IPC International Inc, formerly Institute for Printed Circuits |
Publication Date | 1998-02-01 |
Pages Count | 32 |
Language | English |
File Size | 942.1 KB |
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