{"id":235770,"date":"2024-10-19T15:22:59","date_gmt":"2024-10-19T15:22:59","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-1237002001\/"},"modified":"2024-10-25T09:58:55","modified_gmt":"2024-10-25T09:58:55","slug":"bs-1237002001","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-1237002001\/","title":{"rendered":"BS 123700:2001"},"content":{"rendered":"
This British Standard specifies characteristics to be assessed and test methods to be used for capability approval testing and for quality conformity inspection (lot-by-lot and periodic inspection). It is applicable for all flex-rigid double-sided printed boards with through-connections, irrespective of their method of manufacture, when they are ready for the mounting of components.<\/p>\n
This British Standard is a sectional specification intended for use with the IECQ system of quality assessment for electronic components.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | BRITISH STANDARD <\/td>\n<\/tr>\n | ||||||
2<\/td>\n | Committees responsible for this British Standard <\/td>\n<\/tr>\n | ||||||
3<\/td>\n | Contents <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 3.1 relevant specification 4 General requirements 5 Capability approval 5.1 Basic capability 5.2 Additional capability 5.3 Maintenance of capability approval <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | 6 Relevant specification 7 Capability test programme 8 Quality conformity inspection 8.1 General 8.2 Sampling plans 8.3 Inspection groups <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | Table 1 – Group A quality conformity inspection <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | Table 2 – Group B quality conformity inspection <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Table 3 – Group C quality conformity inspection <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 9 Test patterns and test boards 9.1 General 9.2 Capability approval testing 9.3 Composite test pattern Table 4 – Test specimen details <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 9.4 Structure of a typical test board Table 5 – Structure of a typical test board 9.5 Multiple arrangements of the composite test pattern <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Figure 1 – Composite test pattern \u2014 Layer 1 <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Figure 2 – Composite test pattern \u2014 Layer 2 <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Figure 3 – Composite test pattern \u2014 Specimens A, B and C <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 4 – Composite test pattern \u2014 Specimens D and E <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 5 – Composite test pattern \u2014 Specimens F and G <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Figure 6 – Composite test pattern \u2014 Specimens H and J <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Figure 7 – Composite test pattern \u2014 Specimens K, M and N <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Figure 8 – Examples of multiple arrangements <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Figure 9 – Examples of soldered holes <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Figure 10 – Methods of reinforcing lands <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Figure 11 – Examples relating to access holes <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure 12 – Examples of delamination <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections<\/b><\/p>\n |