{"id":424951,"date":"2024-10-20T06:54:14","date_gmt":"2024-10-20T06:54:14","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iec-60115-42022\/"},"modified":"2024-10-26T13:00:01","modified_gmt":"2024-10-26T13:00:01","slug":"bs-iec-60115-42022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iec-60115-42022\/","title":{"rendered":"BS IEC 60115-4:2022"},"content":{"rendered":"

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
4<\/td>\nBlank Page <\/td>\n<\/tr>\n
5<\/td>\nCONTENTS <\/td>\n<\/tr>\n
11<\/td>\nFOREWORD <\/td>\n<\/tr>\n
14<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
15<\/td>\n3 Terms, definitions, product types, product technologies and product classification
3.1 Terms and definitions <\/td>\n<\/tr>\n
16<\/td>\n3.2 Product types
3.2.1 General
3.2.2 Axial type
3.2.3 Radial type
Figures
Figure 1 \u2013 Illustrations of typical axial leaded power resistors
Figure 2 \u2013 Illustrations of typical radial leaded power resistors <\/td>\n<\/tr>\n
17<\/td>\n3.2.4 Vertical type
3.2.5 Tubular types
Figure 3 \u2013 Illustrations of typical vertical leaded power resistors with punched terminals
Figure 4 \u2013 Illustrations of typical tubular type power resistors <\/td>\n<\/tr>\n
18<\/td>\n3.2.6 Metal housed wire-wound resistors
3.2.7 Any other type
3.3 Resistor encapsulation and material of termination
3.3.1 Conformal lacquer coat
3.3.2 Silicone cement coating
Figure 5 \u2013 Illustrations of typical metal housed power resistors <\/td>\n<\/tr>\n
19<\/td>\n3.3.3 Enamel coating
3.3.4 Ceramic housed resistor
3.3.5 Wire termination
3.4 Product technologies
3.4.1 General <\/td>\n<\/tr>\n
20<\/td>\n3.4.2 Metal film technology
3.4.3 Metal glaze technology
3.4.4 Metal oxide technology
3.4.5 Wire-wound technology
3.4.6 Metal strip technology <\/td>\n<\/tr>\n
21<\/td>\n3.4.7 Any other technology
3.5 Product classification
4 Preferred characteristics
4.1 General
4.2 Preferred types, styles and dimensions
4.2.1 Axial type <\/td>\n<\/tr>\n
22<\/td>\nFigure 6 \u2013 Shape and dimensions of cylindrical axial leaded resistors
Tables
Table 1 \u2013 Examples of preferred styles of cylindrical axial leaded power resistors <\/td>\n<\/tr>\n
23<\/td>\nFigure 7 \u2013 Alternative methods for specification of the length of excessive protective coating or welding beads on axial leaded resistors <\/td>\n<\/tr>\n
24<\/td>\nFigure 8 \u2013 Lead-wire spacing of axial leaded resistors with bent leads <\/td>\n<\/tr>\n
25<\/td>\n4.2.2 Ceramic housed type with axial lead wires
Figure 9 \u2013 Specification of the lead eccentricity of axial leaded resistors
Figure 10 \u2013 Shape and dimensions of axial leaded ceramic housed resistors <\/td>\n<\/tr>\n
26<\/td>\n4.2.3 Ceramic housed type with radial lead wires
Table 2 \u2013 Examples of preferred styles of axial leaded ceramic housed resistors <\/td>\n<\/tr>\n
27<\/td>\nFigure 11 \u2013 Shape and dimensions of radial type ceramic resistors
Table 3 \u2013 Examples of preferred styles of radial type ceramic resistors <\/td>\n<\/tr>\n
28<\/td>\n4.2.4 Radial or vertical ceramic housed type and dimensions
Figure 12 \u2013 Shape and dimensions of radial leaded ceramic resistors <\/td>\n<\/tr>\n
29<\/td>\n4.2.5 Tubular type of power resistors
Figure 13 \u2013 Shape and dimensions of tubular resistors
Table 4 \u2013 Preferred styles of radial or vertical mount ceramic resistors <\/td>\n<\/tr>\n
30<\/td>\n4.2.6 Other types
4.3 Preferred climatic categories
Table 5 \u2013 Example of preferred styles of tubular types of power resistors <\/td>\n<\/tr>\n
31<\/td>\n4.4 Resistance
4.5 Tolerances on resistance
4.6 Rated dissipation Pr <\/td>\n<\/tr>\n
32<\/td>\nFigure 14 \u2013 Typical derating curve for MET > UCT
Figure 15 \u2013 Typical derating curve for power wire-wound resistors <\/td>\n<\/tr>\n
33<\/td>\n4.7 Limiting element voltage Umax
4.8 Insulation voltage Uins
4.9 Insulation resistance Rins
5 Tests and test severities
5.1 General provisions for tests invoked by this specification <\/td>\n<\/tr>\n
34<\/td>\n5.2 Preparation of specimen
5.2.1 Drying
5.2.2 Mounting of power resistors on test boards <\/td>\n<\/tr>\n
35<\/td>\n5.2.3 Mounting of power resistors on test racks
Figure 16 \u2013 Assembly of specimen to the test board <\/td>\n<\/tr>\n
36<\/td>\nFigure 17 \u2013 Mounting of axial leaded specimens on a rack, top view <\/td>\n<\/tr>\n
37<\/td>\n5.2.4 Specification of test boards\/ racks for any other type of high-power resistors
5.3 Details of applicable tests
5.3.1 Resistance
5.3.2 Temperature coefficient of resistance
Figure 18 \u2013 Examples of specimen lead fixation devices <\/td>\n<\/tr>\n
38<\/td>\n5.3.3 Temperature rise
5.3.4 Endurance at the rated temperature 70 \u00b0C <\/td>\n<\/tr>\n
39<\/td>\n5.3.5 Endurance at room temperature <\/td>\n<\/tr>\n
40<\/td>\n5.3.6 Endurance at a maximum temperature: UCT with category dissipation
5.3.7 Short-term overload <\/td>\n<\/tr>\n
41<\/td>\n5.3.8 Single-pulse high-voltage overload test
5.3.9 Periodic-pulse high-voltage overload test <\/td>\n<\/tr>\n
43<\/td>\n5.3.10 Visual examination
5.3.11 Gauging of dimensions
Table 6 \u2013 Preferred alternative overload conditions <\/td>\n<\/tr>\n
44<\/td>\n5.3.12 Detail dimensions
5.3.13 Robustness of the resistor body
5.3.14 Robustness of terminations <\/td>\n<\/tr>\n
45<\/td>\n5.3.15 Bump
5.3.16 Shock
5.3.17 Vibration <\/td>\n<\/tr>\n
46<\/td>\n5.3.18 Rapid change of temperature
5.3.19 Rapid change of temperature, \u2265 100 cycles
5.3.20 Climatic sequence <\/td>\n<\/tr>\n
47<\/td>\n5.3.21 Damp heat, steady state <\/td>\n<\/tr>\n
48<\/td>\n5.3.22 Solderability, with lead-free solder <\/td>\n<\/tr>\n
49<\/td>\n5.3.23 Solderability, with SnPb solder
5.3.24 Resistance to soldering heat <\/td>\n<\/tr>\n
50<\/td>\n5.3.25 Solvent resistance
5.3.26 Insulation resistance
5.3.27 Voltage proof <\/td>\n<\/tr>\n
51<\/td>\n5.4 Optional and\/or additional tests
5.4.1 Single-pulse high-voltage overload test
5.4.2 Periodic-pulse overload test <\/td>\n<\/tr>\n
52<\/td>\n5.4.3 Electrostatic discharge (ESD)
5.4.4 Robustness of threaded stud or screw terminations <\/td>\n<\/tr>\n
53<\/td>\n5.4.5 Operation at low temperature
5.4.6 Damp heat, steady state, accelerated <\/td>\n<\/tr>\n
54<\/td>\n5.4.7 Accidental overload test
5.4.8 Flammability <\/td>\n<\/tr>\n
55<\/td>\n6 Performance requirements
6.1 General
6.2 Limits for change of resistance at test <\/td>\n<\/tr>\n
56<\/td>\nTable 7 \u2013 Limits for resistance variations at tests <\/td>\n<\/tr>\n
57<\/td>\n6.3 Temperature coefficient of resistance
6.4 Temperature rise
Table 8 \u2013 Permitted change of resistance due to the temperature coefficient of resistance <\/td>\n<\/tr>\n
58<\/td>\n6.5 Visual inspection
6.5.1 General visual criteria
6.5.2 Visual criteria after tests
6.5.3 Visual criteria for the packaging
6.6 Solderability <\/td>\n<\/tr>\n
59<\/td>\n6.7 Insulation resistance
6.8 Flammability
6.9 Accidental overload test
7 Marking, packaging and ordering information
7.1 Marking of the component
7.2 Packaging <\/td>\n<\/tr>\n
60<\/td>\n7.3 Marking of the packaging
7.4 Ordering information
8 Detail specifications
8.1 General <\/td>\n<\/tr>\n
61<\/td>\n8.2 Information to be specified in a detail specification
8.2.1 Outline drawing or illustration
8.2.2 Type, style, and dimensions
8.2.3 Climatic category
8.2.4 Resistance range
8.2.5 Tolerances on rated resistance
8.2.6 Rated dissipation P70 <\/td>\n<\/tr>\n
62<\/td>\n8.2.7 Limiting element voltage Umax
8.2.8 Insulation voltage Uins
8.2.9 Insulation resistance Rins
8.2.10 Tests and test severities
8.2.11 Limits of resistance change after testing
8.2.12 Temperature coefficient of resistance
8.2.13 Marking
8.2.14 Ordering information
8.2.15 Mounting <\/td>\n<\/tr>\n
63<\/td>\n8.2.16 Storage
8.2.17 Transportation
8.2.18 Additional information
8.2.19 Quality assessment procedures
9 Quality assessment procedures
9.1 General
9.2 Definitions
9.2.1 Primary stage of manufacture
9.2.2 Structurally similar components <\/td>\n<\/tr>\n
64<\/td>\n9.2.3 Assessment level EZ
9.3 Formation of inspection lots <\/td>\n<\/tr>\n
65<\/td>\n9.4 Approved component (IECQ AC) procedures
9.5 Qualification approval (QA) procedures
9.5.1 General
9.5.2 Qualification approval
9.5.3 Quality conformance inspection <\/td>\n<\/tr>\n
66<\/td>\n9.6 Capability certification (IECQ AC-C) procedures
9.7 Technology certification (IECQ-AC-TC) procedures
9.8 Periodical evaluation of termination platings
9.9 Delayed delivery
9.10 Certified test records
9.11 Certificate of conformity (CoC) <\/td>\n<\/tr>\n
67<\/td>\nTable 9 \u2013 Test schedule for the qualification approval of power resistors <\/td>\n<\/tr>\n
72<\/td>\nTable 10 \u2013 Test schedule for quality conformance inspection of power resistors <\/td>\n<\/tr>\n
77<\/td>\nAnnex A (normative)Symbols and abbreviated terms
A.1 Symbols <\/td>\n<\/tr>\n
80<\/td>\nA.2 Abbreviated terms <\/td>\n<\/tr>\n
82<\/td>\nAnnex B (normative)Visual inspection acceptance criteria
B.1 General
B.2 Acceptance criteria for a general visual inspection of body of specimens
B.3 Acceptance criteria for a general visual inspection of the terminals
B.4 Acceptance criteria for a general visual inspection of specimen after test <\/td>\n<\/tr>\n
83<\/td>\nAnnex C (normative)Workmanship requirements for the assembly of power resistors
C.1 General
C.2 Lead forming
C.2.1 General
Figure C.1 \u2013 Lead forming dimensions <\/td>\n<\/tr>\n
84<\/td>\nC.2.2 Means for support of mounting height
Table C.1 \u2013 Lead bend radius <\/td>\n<\/tr>\n
85<\/td>\nC.3 Mounting
C.3.1 General
Figure C.2 \u2013 Examples of mounting height support
Table C.2 \u2013 Recommended circuit board bore diameters <\/td>\n<\/tr>\n
86<\/td>\nC.3.2 Lateral mounting
Figure C.3 \u2013 Clearance between coating and solder
Figure C.4 \u2013 Lateral mounting <\/td>\n<\/tr>\n
87<\/td>\nC.3.3 Upright mounting
Figure C.5 \u2013 Upright mounting
Table C.3 \u2013 Clearance of lateral mounted resistors <\/td>\n<\/tr>\n
88<\/td>\nC.4 Lead trimming
Figure C.6 \u2013 Lead protrusion <\/td>\n<\/tr>\n
89<\/td>\nFigure C.7 \u2013 Lead end distortion <\/td>\n<\/tr>\n
90<\/td>\nAnnex D (informative)Zero ohm resistors (jumpers) <\/td>\n<\/tr>\n
91<\/td>\nAnnex E (informative)Guide on the application of optional and\/or additional tests
E.1 General
E.2 Endurance at room temperature <\/td>\n<\/tr>\n
92<\/td>\nE.3 Single-pulse high-voltage overload test
Table E.1 \u2013 Implementation of the test endurance at room temperature <\/td>\n<\/tr>\n
93<\/td>\nE.4 Periodic-pulse overload test
Table E.2 \u2013 Implementation of the single-pulse high-voltage overload test <\/td>\n<\/tr>\n
94<\/td>\nE.5 Operation at low temperature
Table E.3 \u2013 Implementation of the periodic-pulse overload test <\/td>\n<\/tr>\n
95<\/td>\nE.6 Damp heat, steady state, accelerated
Table E.4 \u2013 Implementation of the operation at low temperature test <\/td>\n<\/tr>\n
96<\/td>\nE.7 Accidental overload test
Table E.5 \u2013 Implementation of the test damp heat, steady state, accelerated <\/td>\n<\/tr>\n
97<\/td>\nE.8 Flammability test
Table E.6 \u2013 Implementation of the test accidental overload test <\/td>\n<\/tr>\n
98<\/td>\nE.9 Electrostatic discharge test (ESD)
Table E.7 \u2013 Implementation of the test flammability <\/td>\n<\/tr>\n
99<\/td>\nE.10 Robustness of threaded stud or screw terminations
Table E.8 \u2013 Implementation of the test Electrostatic discharge (ESD) <\/td>\n<\/tr>\n
100<\/td>\nTable E.9 \u2013 Implementation of the test Robustness of threaded stud or screw terminations <\/td>\n<\/tr>\n
101<\/td>\nAnnex F (informative)Radial formed types from axial styles
F.1 General
F.1.1 Applicability of this annex
F.1.2 Denomination of radial formed styles <\/td>\n<\/tr>\n
102<\/td>\nFigure F.1 \u2013 Production flow and different scopes of quality assurance <\/td>\n<\/tr>\n
103<\/td>\nF.1.3 Coated lead wires
F.1.4 Means for support of mounting height <\/td>\n<\/tr>\n
104<\/td>\nF.1.5 Means for retention
F.2 Radial formed types for through hole assembly
F.2.1 Radial formed style with lateral body position
Figure F.2 \u2013 Shape and dimensions of radial formed resistorfor lateral body position
Figure F.3 \u2013 Shape and dimensions of radial formed resistor for lateral body position with kinked lead wires <\/td>\n<\/tr>\n
105<\/td>\nTable F.1 \u2013 Feasible lead-wire spacing of radial formed resistor for lateral body position <\/td>\n<\/tr>\n
106<\/td>\nF.2.2 Radial formed style with upright body position
Figure F.4 \u2013 Shape and dimensions of radial formed resistor for upright body position
Figure F.5 \u2013 Shape and dimensions of radial formed resistor for upright body position and wide spacing <\/td>\n<\/tr>\n
107<\/td>\nFigure F.6 \u2013 Shape and dimensions of radial formed resistor for upright body position and wide spacing, with kinked lead wire <\/td>\n<\/tr>\n
108<\/td>\nF.3 Radial formed types for surface-mount assembly
Figure F.7 \u2013 Shape and dimensions of radial formed resistor for surface-mount assembly (Z-bend)
Table F.2 \u2013 Feasible lead-wire spacing of radial formed resistor for upright body position <\/td>\n<\/tr>\n
109<\/td>\nF.4 Packaging
F.4.1 Packaging of resistors formed for through-hole assembly
Figure F.8 \u2013 Land pattern dimensions for surface-mount assembly <\/td>\n<\/tr>\n
110<\/td>\nF.4.2 Packaging of resistors formed for surface-mount assembly
F.5 Quality assessment
F.5.1 General
F.5.2 Quality assessment of formed resistors <\/td>\n<\/tr>\n
111<\/td>\nF.5.3 Forming of finished resistors of assessed quality
F.5.4 Special inspection requirements <\/td>\n<\/tr>\n
112<\/td>\nAnnex X (informative)Cross references for the prior revision of this specification <\/td>\n<\/tr>\n
113<\/td>\nTable X.1 \u2013 Cross reference for references to clauses <\/td>\n<\/tr>\n
114<\/td>\nTable X.2 \u2013 Cross reference for references to figures
Table X.3 \u2013 Cross reference for references to tables <\/td>\n<\/tr>\n
115<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Fixed resistors for use in electronic equipment – Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2023<\/td>\n118<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":424956,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[558,2641],"product_tag":[],"class_list":{"0":"post-424951","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-040-10","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/424951","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/424956"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=424951"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=424951"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=424951"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}